RF-10 High Frequency material design for Double Sided PCB, Multilayer PCB, Hybrid PCB using in microstrip patch antennas

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RF-10 High Frequency PCB

Introduction

RF-10 laminates are a composite material consisting of ceramic filled PTFE and woven fiberglass. These laminates offer several advantages, including a high dielectric constant and low dissipation factor. The incorporation of thin woven fiberglass reinforcement provides a dual benefit of low dielectric loss and improved rigidity, making the material easier to handle and enhancing its dimensional stability for multilayer circuits.

RF-10 laminates demonstrate low coefficients of expansion in the X, Y, and Z directions. This characteristic ensures exceptional reliability for plated through hole connections and reduces the scaling factors required for artwork compensation.

Features and Benefits

RF-10 has a dielectric constant of 10.2 ± 0.3 and a dissipation factor of 0.0025 at 10 GHz. This high dielectric constant enables the reduction of RF circuit size, while the low loss tangent minimizes signal loss and maintains excellent signal quality.

RF-10 exhibits a thermal conductivity of 0.85 W/M*K when unclad. This property allows for efficient dissipation of heat generated by the circuit, ensuring optimal performance even in demanding thermal conditions, and preventing overheating.

RF-10 laminates demonstrate exceptional adhesion to smooth copper surfaces, ensuring strong and reliable bonding between the laminate and the copper.

RF-10 has a coefficient of thermal expansion (CTE) of 16 ppm/°C in the X-axis, 20 ppm/°C in the Y-axis, and 25 ppm/°C in the Z-axis. These low coefficients of expansion in all three directions contribute to stable and reliable plated through hole connections, enhancing the overall reliability of the PCB.

PCB Capability

The manufacturing capability covers double-sided PCBs, multilayer PCBs, and hybrid PCBs, allowing for the production of PCBs with varying complexity and functionality.

The available options for copper weight include 0.5oz (17 µm), 1oz (35µm), and 2oz (70µm).

The manufacturing capability accommodates different PCB thicknesses, including 10mil, 20mil, 25mil, 60mil, and 125mil.

The maximum PCB size that can be manufactured is 400mm X 500mm.

Various solder mask options are available, including colors like green, black, blue, yellow, and red etc.

The available surface finish options include bare copper, HASL, ENIG, immersion silver, immersion tin, OSP, pure gold, and ENEPIG etc.

Applications

RF-10 PCBs find applications in microstrip patch antennas, GPS antennas, passive components, aircraft collision avoidance systems, and satellite components etc.

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