CuClad 233 DK2.33 raw material double sided substarte Copper-Clad Laminate with with 1/2, 1 or 2 oz copper on both s ides

CuClad® 233 Copper-Clad Laminate: The Ideal Balance of Low Loss, Isotropy, and Processability

We are pleased to present the CuClad® 233, a high-performance woven fiberglass/PTFE laminate that represents the optimal middle ground within the renowned CuClad series. Engineered by Rogers Corporation, it delivers a superior combination of low-loss electrical performance, unique mechanical isotropy, and enhanced manufacturability, making it a versatile and reliable choice for a broad spectrum of RF and microwave applications where consistency and precision are paramount.

Engineered for X-Y Plane Isotropy
Like all CuClad laminates, the 233 variant is defined by its patented cross-plied woven fiberglass reinforcement. This construction, where alternating glass plies are oriented 90 degrees to each other, provides true electrical and mechanical isotropy in the X-Y plane. This means the material's dielectric constant, thermal expansion, and mechanical strength are uniform regardless of direction across the board surface. This property is critical for complex circuits like phased array antennas and directional couplers, ensuring predictable performance and eliminating directional biases that can arise in standard unidirectional or non-woven laminates.

Typical Properties: CuClad

Electrical Characteristics for Designs
CuClad 233 is formulated with a medium fiberglass-to-PTFE ratio, striking an ideal balance between the ultra-low loss of CuClad 217 and the high mechanical strength of CuClad 250. 

Dielectric Constant: A consistent Dk of 2.33 at both 1 MHz and 10 GHz, providing reliable impedance control and simplifying the design process from simulation to production.

Low Dissipation Factor: A Df of 0.0013 at 10 GHz, ensuring minimal signal attenuation for sensitive components like low-noise amplifiers (LNAs), filters, and couplers.

Frequency Stability: The datasheet confirms that both Dk and Df remain stable across a wide frequency range, offering a dependable platform for broadband and multi-band applications.

Mechanical and Reliability
The cross-plied structure and balanced composition give CuClad 233 robust physical properties that support reliable fabrication and long-term operation:

Superior Dimensional Stability: Offers greater stability than non-woven laminates, which is crucial for maintaining registration in multilayer boards and during thermal cycling.

Favorable Thermal Expansion: Features a low and balanced in-plane CTE of 23-24 ppm/°C, closely matching that of copper. This minimizes stress on plated through-holes and copper traces, significantly enhancing the reliability of assemblies subjected to temperature fluctuations.

Strong Mechanical Foundation: Provides substantial tensile strength (over 10 kpsi) and peel strength (14 lbs/in), ensuring it can withstand the rigors of PCB processing, assembly, and operation in demanding environments.

Proven Suitability for High-Reliability Sectors
CuClad 233 is designed to meet the stringent requirements of advanced electronics. It exhibits extremely low moisture absorption (0.02%), meets NASA outgassing standards, and carries a UL 94 V-0 flammability rating. These attributes make it a trusted substrate for aerospace, defense, and space applications where material consistency and environmental resilience are non-negotiable.

Application

1. Phased Array and Military Radar Antennas
2. Electronic Warfare (EW) and Surveillance Systems
3. Precision Microwave Components (Filters, Hybrids, Power Dividers)
4. Satellite Communication Payloads
5. Multilayer RF Boards requiring isotropic behavior

Material Availability:
CuClad laminates are supplied with 1/2, 1, or 2 ounce electrodeposited copper on both s ides. Other copper weights and rolled copper foil are available. CuClad is available bonded to a heavy metal ground plane. Aluminum, brass, or copper plates also provide an integral heat sink and mechanical support to the substrate.

When ordering CuClad products
please specify dielectric constant, thickness, cladding, panel size and any other special considerations. Available master sheet sizes include 36" x 36" in a crossplied configuration and 36" x 48" in a parallel plied configuration.

In summary, CuClad 233 is the intelligent choice for designers who require the isotropic advantages of the CuClad series without needing the absolute lowest Dk or the highest mechanical stiffness. It delivers a proven, balanced, and highly reliable performance package that streamlines design, improves yield, and ensures consistent operation in the most challenging RF environments. Contact us today to discuss how CuClad 233 can be the foundation for your next high-performance project.

Material Availability:
CuClad laminates are supplied with 1/2, 1, or 2 ounce electrodeposited copper on both sides. Other copper weights and rolled copper foil are available. CuClad is available bonded to a heavy metal ground plane. Aluminum, brass, or copper plates also provide an integral heat sink and mechanical support to the substrate.

When ordering CuClad products
please specify dielectric constant, thickness, cladding, panel size and any other special considerations. Available master sheet sizes include 36" x 36" in a crossplied configuration and 36" x 48" in a parallel plied configuration.