| МОК: | 1 шт. |
| цена: | 0.99-99USD/PCS |
| стандартная упаковка: | Упаковка |
| Срок доставки: | 2-10 рабочих дней |
| способ оплаты: | Т/Т, ПайПал |
| Пропускная способность: | 50000 шт. |
FR408HR Multi-Layer PCBs with Immersion Gold Finish
The FR408HR Multi-Layer PCBs are high-performance printed circuit boards designed for advanced electronic applications requiring exceptional signal integrity, thermal stability, and reliability. Built with Isola's FR408HR laminate, these PCBs offer excellent electrical and mechanical properties, making them ideal for high-speed digital, RF, and microwave designs. With 1oz copper per layer, immersion gold (ENIG) surface finish, and blue solder mask with white silkscreen, these PCBs are a robust solution for modern electronics.
![]()
This product highlights two case studies showcasing the versatility of FR408HR material for multi-layer PCB designs.
Case Study 1: 6-Layer PCB
| Specification | Details |
| Board Type | Six-layer PCB |
| Dimensions | 79mm x 105mm (1 piece) |
| Lamination Thickness | 1.60mm |
| Copper Thickness | 1oz (35μm) per layer |
| Surface Finish | Immersion Gold (ENIG) |
| Solder Mask | Blue (top and bottom layers) |
| Silkscreen | White lettering (top and bottom layers) |
| Special Structure | Resin-filled holes (0.2mm-0.4mm diameter) |
Case Study 2: 4-Layer PCB
| Specification | Details |
| Board Type | Four-layer PCB |
| Dimensions | 96mm x 115mm (1 piece) |
| Lamination Thickness | 1.58mm |
| Copper Thickness | 1oz (35μm) per layer |
| Surface Finish | Immersion Gold (ENIG) |
| Solder Mask | Blue (top and bottom layers) |
| Silkscreen | White lettering (top and bottom layers) |
| Special Structure | Blind vias (L1-L3) |
FR408HR Typical Values Table
| Property | Typical Value | Units | Test Method | |
| Metric (English) | IPC-TM-650 (or as noted) | |||
| Glass Transition Temperature (Tg) by DSC | 190 | °C | 2.4.25C | |
| Decomposition Temperature (Td) by TGA @ 5% weight loss | 360 | °C | 2.4.24.6 | |
| Time to Delaminate by TMA (Copper removed) | A. T260 | 60 | Minutes | 2.4.24.1 |
| B. T288 | >30 | |||
| Z-Axis CTE | A. Pre-Tg | 55 | ppm/°C | 2.4.24C |
| B. Post-Tg | 230 | ppm/°C % | ||
| C. 50 to 260°C, (Total Expansion) | 2.8 | |||
| X/Y-Axis CTE | Pre-Tg | 16 | ppm/°C | 2.4.24C |
| Thermal Conductivity | 0.4 | W/m·K | ASTM E1952 | |
| Thermal Stress 10 sec @ 288ºC (550.4ºF) | A. Unetched | Pass | Pass Visual | 2.4.13.1 |
| B. Etched | ||||
| A. @ 100 MHz | 3.72 | 2.5.5.3 | ||
| Dk, Permittivity | B. @ 1 GHz | 3.69 | — | 2.5.5.9 |
| C. @ 2 GHz | 3.68 | Bereskin Stripline | ||
| D. @ 5 GHz | 3.64 | Bereskin Stripline | ||
| E. @ 10 GHz | 3.65 | Bereskin Stripline | ||
| A. @ 100 MHz | 0.0072 | 2.5.5.3 | ||
| Df, Loss Tangent | B. @ 1 GHz | 0.0091 | — | 2.5.5.9 |
| C. @ 2 GHz | 0.0092 | Bereskin Stripline | ||
| D. @ 5 GHz | 0.0098 | Bereskin Stripline | ||
| E. @ 10 GHz | 0.0095 | Bereskin Stripline | ||
| Volume Resistivity | A. After moisture resistance | 4.4 x 107 | M阝-cm | 2.5.17.1 |
| B. At elevated temperature | 9.4 x 107 | |||
| Surface Resistivity | A. After moisture resistance | 2.6 x 106 | M阝 | 2.5.17.1 |
| B. At elevated temperature | 2.1 x 108 | |||
| Dielectric Breakdown | >50 | kV | 2.5.6B | |
| Arc Resistance | 137 | Seconds | 2.5.1B | |
| Electric Strength (Laminate & laminated prepreg) | 70 (1741) | kV/mm (V/mil) | 2.5.6.2A | |
| Comparative Tracking Index (CTI) | 2 (250-399) | Class (Volts) | UL 746A | |
| ASTM D3638 | ||||
| A. Low profile copper foil and very low profile copper foil all copper foil >17 阝m [0.669 mil] | 1.14 (6.5) | 2.4.8C | ||
| Peel Strength | B. Standard profile copper | 0.96 (5.5) | N/mm (lb/inch) | 2.4.8.2A 2.4.8.3 |
| 1. After thermal stress | 0.90 (5.1) | |||
| 2. After process solutions | ||||
| Flexural Strength | A. Length direction | 72.5 | ksi | 2.4.4B |
| B. Cross direction | 58 | |||
| Tensile Strength | A. Length direction | 54.5 | ksi | ASTM D3039 |
| B. Cross direction | 38.7 | |||
| Young's Modulus | A. Length direction | 3695 | ksi | ASTM D790-15e2 |
| B. Cross direction | 3315 | |||
| Poisson's Ratio | A. Length direction | 0.137 | — | ASTM D3039 |
| B. Cross direction | 0.133 | |||
| Moisture Absorption | 0.061 | % | 2.6.2.1A | |
| Flammability (Laminate & laminated prepreg) | V-0 | Rating | UL 94 | |
| Relative Thermal Index (RTI) | 130 | °C | UL 796 | |
Key Features of FR408HR:
Low-loss material for high-speed signal integrity.
Excellent thermal reliability for lead-free soldering.
Low moisture absorption for enhanced performance in humid environments.
High Tg and Td values for thermal stability.
CTE matching to copper, minimizing risk of delamination.
Benefits of FR408HR Multi-Layer PCBs
High Signal Integrity: The low DkD_kDk and DF ensure consistent performance for high-speed and high-frequency applications.
Exceptional Durability: Resin-filled holes and blind vias enhance mechanical stability and support compact, high-density designs.
Thermal Reliability: With a high Tg and excellent resistance to thermal stress, the PCBs maintain structural integrity during manufacturing and operation.
Corrosion Resistance: The ENIG surface finish protects against oxidation and ensures long-term reliability.
Customizability: FR408HR supports complex via structures and multi-layer configurations, allowing for tailored designs.
Applications
The FR408HR Multi-Layer PCBs are suitable for a wide range of applications, including:
Telecommunications Equipment: Routers, switches, and base stations.
Aerospace and Defense: Radar systems and avionics.
Consumer Electronics: Smartphones, tablets, and IoT devices.
High-Speed Digital Systems: Servers, data centers, and network infrastructure.
RF and Microwave Applications: Antennas, filters, and amplifiers.
Conclusion
The FR408HR Multi-Layer PCBs are engineered to deliver exceptional performance and reliability for advanced electronic systems. Whether it’s the six-layer PCB with resin-filled holes or the four-layer PCB with blind vias, these boards leverage the superior properties of FR408HR laminate to meet the demands of industries such as telecommunications, aerospace, and consumer electronics. With their robust construction, customizable designs, and high electrical performance, these PCBs are the ideal solution for applications requiring precision and durability.
| МОК: | 1 шт. |
| цена: | 0.99-99USD/PCS |
| стандартная упаковка: | Упаковка |
| Срок доставки: | 2-10 рабочих дней |
| способ оплаты: | Т/Т, ПайПал |
| Пропускная способность: | 50000 шт. |
FR408HR Multi-Layer PCBs with Immersion Gold Finish
The FR408HR Multi-Layer PCBs are high-performance printed circuit boards designed for advanced electronic applications requiring exceptional signal integrity, thermal stability, and reliability. Built with Isola's FR408HR laminate, these PCBs offer excellent electrical and mechanical properties, making them ideal for high-speed digital, RF, and microwave designs. With 1oz copper per layer, immersion gold (ENIG) surface finish, and blue solder mask with white silkscreen, these PCBs are a robust solution for modern electronics.
![]()
This product highlights two case studies showcasing the versatility of FR408HR material for multi-layer PCB designs.
Case Study 1: 6-Layer PCB
| Specification | Details |
| Board Type | Six-layer PCB |
| Dimensions | 79mm x 105mm (1 piece) |
| Lamination Thickness | 1.60mm |
| Copper Thickness | 1oz (35μm) per layer |
| Surface Finish | Immersion Gold (ENIG) |
| Solder Mask | Blue (top and bottom layers) |
| Silkscreen | White lettering (top and bottom layers) |
| Special Structure | Resin-filled holes (0.2mm-0.4mm diameter) |
Case Study 2: 4-Layer PCB
| Specification | Details |
| Board Type | Four-layer PCB |
| Dimensions | 96mm x 115mm (1 piece) |
| Lamination Thickness | 1.58mm |
| Copper Thickness | 1oz (35μm) per layer |
| Surface Finish | Immersion Gold (ENIG) |
| Solder Mask | Blue (top and bottom layers) |
| Silkscreen | White lettering (top and bottom layers) |
| Special Structure | Blind vias (L1-L3) |
FR408HR Typical Values Table
| Property | Typical Value | Units | Test Method | |
| Metric (English) | IPC-TM-650 (or as noted) | |||
| Glass Transition Temperature (Tg) by DSC | 190 | °C | 2.4.25C | |
| Decomposition Temperature (Td) by TGA @ 5% weight loss | 360 | °C | 2.4.24.6 | |
| Time to Delaminate by TMA (Copper removed) | A. T260 | 60 | Minutes | 2.4.24.1 |
| B. T288 | >30 | |||
| Z-Axis CTE | A. Pre-Tg | 55 | ppm/°C | 2.4.24C |
| B. Post-Tg | 230 | ppm/°C % | ||
| C. 50 to 260°C, (Total Expansion) | 2.8 | |||
| X/Y-Axis CTE | Pre-Tg | 16 | ppm/°C | 2.4.24C |
| Thermal Conductivity | 0.4 | W/m·K | ASTM E1952 | |
| Thermal Stress 10 sec @ 288ºC (550.4ºF) | A. Unetched | Pass | Pass Visual | 2.4.13.1 |
| B. Etched | ||||
| A. @ 100 MHz | 3.72 | 2.5.5.3 | ||
| Dk, Permittivity | B. @ 1 GHz | 3.69 | — | 2.5.5.9 |
| C. @ 2 GHz | 3.68 | Bereskin Stripline | ||
| D. @ 5 GHz | 3.64 | Bereskin Stripline | ||
| E. @ 10 GHz | 3.65 | Bereskin Stripline | ||
| A. @ 100 MHz | 0.0072 | 2.5.5.3 | ||
| Df, Loss Tangent | B. @ 1 GHz | 0.0091 | — | 2.5.5.9 |
| C. @ 2 GHz | 0.0092 | Bereskin Stripline | ||
| D. @ 5 GHz | 0.0098 | Bereskin Stripline | ||
| E. @ 10 GHz | 0.0095 | Bereskin Stripline | ||
| Volume Resistivity | A. After moisture resistance | 4.4 x 107 | M阝-cm | 2.5.17.1 |
| B. At elevated temperature | 9.4 x 107 | |||
| Surface Resistivity | A. After moisture resistance | 2.6 x 106 | M阝 | 2.5.17.1 |
| B. At elevated temperature | 2.1 x 108 | |||
| Dielectric Breakdown | >50 | kV | 2.5.6B | |
| Arc Resistance | 137 | Seconds | 2.5.1B | |
| Electric Strength (Laminate & laminated prepreg) | 70 (1741) | kV/mm (V/mil) | 2.5.6.2A | |
| Comparative Tracking Index (CTI) | 2 (250-399) | Class (Volts) | UL 746A | |
| ASTM D3638 | ||||
| A. Low profile copper foil and very low profile copper foil all copper foil >17 阝m [0.669 mil] | 1.14 (6.5) | 2.4.8C | ||
| Peel Strength | B. Standard profile copper | 0.96 (5.5) | N/mm (lb/inch) | 2.4.8.2A 2.4.8.3 |
| 1. After thermal stress | 0.90 (5.1) | |||
| 2. After process solutions | ||||
| Flexural Strength | A. Length direction | 72.5 | ksi | 2.4.4B |
| B. Cross direction | 58 | |||
| Tensile Strength | A. Length direction | 54.5 | ksi | ASTM D3039 |
| B. Cross direction | 38.7 | |||
| Young's Modulus | A. Length direction | 3695 | ksi | ASTM D790-15e2 |
| B. Cross direction | 3315 | |||
| Poisson's Ratio | A. Length direction | 0.137 | — | ASTM D3039 |
| B. Cross direction | 0.133 | |||
| Moisture Absorption | 0.061 | % | 2.6.2.1A | |
| Flammability (Laminate & laminated prepreg) | V-0 | Rating | UL 94 | |
| Relative Thermal Index (RTI) | 130 | °C | UL 796 | |
Key Features of FR408HR:
Low-loss material for high-speed signal integrity.
Excellent thermal reliability for lead-free soldering.
Low moisture absorption for enhanced performance in humid environments.
High Tg and Td values for thermal stability.
CTE matching to copper, minimizing risk of delamination.
Benefits of FR408HR Multi-Layer PCBs
High Signal Integrity: The low DkD_kDk and DF ensure consistent performance for high-speed and high-frequency applications.
Exceptional Durability: Resin-filled holes and blind vias enhance mechanical stability and support compact, high-density designs.
Thermal Reliability: With a high Tg and excellent resistance to thermal stress, the PCBs maintain structural integrity during manufacturing and operation.
Corrosion Resistance: The ENIG surface finish protects against oxidation and ensures long-term reliability.
Customizability: FR408HR supports complex via structures and multi-layer configurations, allowing for tailored designs.
Applications
The FR408HR Multi-Layer PCBs are suitable for a wide range of applications, including:
Telecommunications Equipment: Routers, switches, and base stations.
Aerospace and Defense: Radar systems and avionics.
Consumer Electronics: Smartphones, tablets, and IoT devices.
High-Speed Digital Systems: Servers, data centers, and network infrastructure.
RF and Microwave Applications: Antennas, filters, and amplifiers.
Conclusion
The FR408HR Multi-Layer PCBs are engineered to deliver exceptional performance and reliability for advanced electronic systems. Whether it’s the six-layer PCB with resin-filled holes or the four-layer PCB with blind vias, these boards leverage the superior properties of FR408HR laminate to meet the demands of industries such as telecommunications, aerospace, and consumer electronics. With their robust construction, customizable designs, and high electrical performance, these PCBs are the ideal solution for applications requiring precision and durability.