logo
продукты
Подробная информация о продукции
Домой > продукты >
DK value 3.3 RO4533 PCB built on 20mil high-frequency laminate, get the quote for your antenna design

DK value 3.3 RO4533 PCB built on 20mil high-frequency laminate, get the quote for your antenna design

МОК: 1 шт.
цена: 2.99USD/pcs
стандартная упаковка: Упаковка
Срок доставки: 2-10 рабочих дней
способ оплаты: Т/Т, ПайПал
Пропускная способность: 50000 шт.
Подробная информация
Место происхождения
Китай
Фирменное наименование
Rogers
Сертификация
ISO9001
Номер модели
RO4533
Количество мин заказа:
1 шт.
Цена:
2.99USD/pcs
Упаковывая детали:
Упаковка
Время доставки:
2-10 рабочих дней
Условия оплаты:
Т/Т, ПайПал
Поставка способности:
50000 шт.
Описание продукта

2-Layer RO4533 PCB | 20mil Core | Immersion Gold Finish

 

 

Product Overview

We are pleased to present this newly customized 2-layer rigid PCB built on Rogers RO4533™ antenna-grade high-frequency laminate. Specifically engineered for mobile infrastructure and base station antenna applications, this ceramic-filled, glass-reinforced hydrocarbon-based material delivers controlled dielectric constant, low loss performance, and excellent passive intermodulation (PIM) response.

 

DK value 3.3 RO4533 PCB built on 20mil high-frequency laminate, get the quote for your antenna design 0

 

The board measures 123.5mm x 46mm (single piece) with a finished thickness of 0.6mm (including 20mil core + 2 x 35μm copper) and dimensional tolerance of ±0.15mm. Minimum trace and space are an impressive 4/5 mils, with a minimum finished hole size of 0.25mm. No blind vias are used in this construction.

 

 

This design features a green top solder mask for circuit protection and component isolation, along with white top silkscreen for clear component identification. The bottom side has no solder mask, optimizing performance where needed. The Immersion Gold surface finish provides excellent solderability, flatness for fine-pitch components, and superior corrosion resistance. Every board undergoes 100% electrical testing prior to shipment and conforms to IPC-Class-2 quality standards. Gerber files are supplied in RS-274-X format, and worldwide shipping is available.

 

 

PCB General Specifications

Parameter Detail
Layer Count 2-Layer Rigid
Base Material Rogers RO4533™ (Ceramic-filled, glass-reinforced hydrocarbon)
Board Dimensions 123.5mm x 46mm (1 PCB) ±0.15mm
Finished Thickness 0.6mm
Core Thickness 20mil (0.508mm) ±0.0015"
Min. Trace / Space 4 / 5 mils
Min. Hole Size 0.25mm
Blind Vias None
Finished Cu Weight 1 oz (1.4 mils / 35μm) outer layers
Via Plating Thickness 20 μm
Surface Finish Immersion Gold
Top Solder Mask Green
Bottom Solder Mask None
Top Silkscreen White
Bottom Silkscreen None
Electrical Test 100% prior to shipment
Artwork Format Gerber RS-274-X
Quality Standard IPC-Class-2
Availability Worldwide
Components / Pads / Vias / Nets 36 / 28 / 17 / 2

 

 

Material Advantages: RO4533™

The RO4533™ laminate from Rogers Corporation is a cost-performance material specifically engineered and manufactured to meet the demanding requirements of the antenna market. As part of the RO4500™ Series, this ceramic-filled, glass-reinforced hydrocarbon-based material set extends the capabilities of the successful RO4000® product series into antenna applications.

 

DK value 3.3 RO4533 PCB built on 20mil high-frequency laminate, get the quote for your antenna design 1

 

Key material highlights:

 

Fully compatible with conventional FR-4 and high-temperature lead-free solder processing – no special treatment needed for plated through-hole preparation, unlike traditional PTFE-based laminates

 

Affordable alternative to more conventional PTFE antenna technologies, allowing designers to optimize price and performance

 

Halogen-free available to meet the most stringent "green" standards

 

Excellent PIM performance – typical values better than -157 dBc using two 43 dBm swept tones at 1900 MHz

 

 

The resin system is designed to provide ideal antenna performance. The CTE in both X and Y directions closely matches that of copper, reducing stresses in the PCB antenna. With a Tg exceeding 280°C, the low Z-axis CTE ensures excellent plated through-hole reliability. These properties, combined with dimensional stability of less than 0.05% (0.2 mm/m), make RO4533 an excellent candidate for printed circuit antenna applications. The material also provides increased thermal conductivity (0.6 W/m·K) over equivalent PTFE/woven glass materials, enabling antenna designs with increased power handling capability.

 

 

RO4533™ Material Properties

Property Test Condition Value Benefit
Dielectric Constant (εr) 10 GHz / 23°C 3.3 ±0.08 Controlled, stable Dk for antenna design
Dielectric Constant (εr) 2.5 GHz / 23°C 3.3 ±0.08 Consistent performance across bands
Dissipation Factor (tan δ) 2.5 GHz / 23°C 0.002 Ultra-low loss for high gain
Dissipation Factor (tan δ) 10 GHz / 23°C 0.0025 Maintains low loss at higher frequencies
PIM (Typical) Reflected 43 dBm swept tones ≤-157 dBc Excellent for base station antennas
Dielectric Strength 0.51 mm thickness >500 V/mil Robust voltage withstand
Dimensional Stability After etch <0.2 mm/m (<0.2 mils/inch) Higher yield on large panels
CTE (X-axis) -55°C to +288°C 13 ppm/°C Matched to copper, reduced stress
CTE (Y-axis) -55°C to +288°C 11 ppm/°C Matched to copper, reduced stress
CTE (Z-axis) -55°C to +288°C 37 ppm/°C Reliable PTH reliability
Thermal Conductivity 80°C 0.6 W/(m·K) Improved power handling
Moisture Absorption D48/50 0.02% Excellent for outdoor antennas
Tg (TMA) >280°C Withstands lead-free processing
Density 1.8 g/cm³ Lightweight
Copper Peel Strength 1 oz EDC, post solder float 1.2 N/mm (6.9 lbs/in) Reliable copper adhesion
Flammability UL 94 Non-FR Application-specific
Lead-Free Process Compatible Yes Ready for modern assembly

 

 

PCB Stackup & Construction

The board features a robust 2-layer stackup:

 

Top Copper (Layer 1): 1 oz (35μm) – Electrodeposited copper

 

Dielectric Core: Rogers RO4533™ – 20mil (0.508mm)

 

Bottom Copper (Layer 2): 1 oz (35μm) – Electrodeposited copper

 

Total Finished Thickness: 0.6mm

 

 

Minimum trace and space are 4/5 mils, with a minimum finished hole size of 0.25mm. Via plating thickness is 20μm, and no blind vias are used. The design supports 36 components, 28 total pads (18 thru-hole, 10 top SMT), 17 vias, and 2 nets.

 

The green top solder mask provides circuit protection and insulation, while the white silkscreen enables clear component identification. The bottom side remains unmasked, which may be beneficial for specific antenna grounding or thermal requirements.

 

 

Typical Applications

Thanks to its low loss, controlled Dk, and excellent PIM response, this PCB is ideally suited for:

 

Cellular infrastructure base station antennas

WiMAX antenna networks

Mobile infrastructure microstrip antenna applications

Passive intermodulation-sensitive designs

 

 

All PCBs are 100% electrically tested and shipped with a Certificate of Conformance per IPC-6012. For Gerber review, stackup confirmation, or volume pricing, please contact our technical sales team.

 

продукты
Подробная информация о продукции
DK value 3.3 RO4533 PCB built on 20mil high-frequency laminate, get the quote for your antenna design
МОК: 1 шт.
цена: 2.99USD/pcs
стандартная упаковка: Упаковка
Срок доставки: 2-10 рабочих дней
способ оплаты: Т/Т, ПайПал
Пропускная способность: 50000 шт.
Подробная информация
Место происхождения
Китай
Фирменное наименование
Rogers
Сертификация
ISO9001
Номер модели
RO4533
Количество мин заказа:
1 шт.
Цена:
2.99USD/pcs
Упаковывая детали:
Упаковка
Время доставки:
2-10 рабочих дней
Условия оплаты:
Т/Т, ПайПал
Поставка способности:
50000 шт.
Описание продукта

2-Layer RO4533 PCB | 20mil Core | Immersion Gold Finish

 

 

Product Overview

We are pleased to present this newly customized 2-layer rigid PCB built on Rogers RO4533™ antenna-grade high-frequency laminate. Specifically engineered for mobile infrastructure and base station antenna applications, this ceramic-filled, glass-reinforced hydrocarbon-based material delivers controlled dielectric constant, low loss performance, and excellent passive intermodulation (PIM) response.

 

DK value 3.3 RO4533 PCB built on 20mil high-frequency laminate, get the quote for your antenna design 0

 

The board measures 123.5mm x 46mm (single piece) with a finished thickness of 0.6mm (including 20mil core + 2 x 35μm copper) and dimensional tolerance of ±0.15mm. Minimum trace and space are an impressive 4/5 mils, with a minimum finished hole size of 0.25mm. No blind vias are used in this construction.

 

 

This design features a green top solder mask for circuit protection and component isolation, along with white top silkscreen for clear component identification. The bottom side has no solder mask, optimizing performance where needed. The Immersion Gold surface finish provides excellent solderability, flatness for fine-pitch components, and superior corrosion resistance. Every board undergoes 100% electrical testing prior to shipment and conforms to IPC-Class-2 quality standards. Gerber files are supplied in RS-274-X format, and worldwide shipping is available.

 

 

PCB General Specifications

Parameter Detail
Layer Count 2-Layer Rigid
Base Material Rogers RO4533™ (Ceramic-filled, glass-reinforced hydrocarbon)
Board Dimensions 123.5mm x 46mm (1 PCB) ±0.15mm
Finished Thickness 0.6mm
Core Thickness 20mil (0.508mm) ±0.0015"
Min. Trace / Space 4 / 5 mils
Min. Hole Size 0.25mm
Blind Vias None
Finished Cu Weight 1 oz (1.4 mils / 35μm) outer layers
Via Plating Thickness 20 μm
Surface Finish Immersion Gold
Top Solder Mask Green
Bottom Solder Mask None
Top Silkscreen White
Bottom Silkscreen None
Electrical Test 100% prior to shipment
Artwork Format Gerber RS-274-X
Quality Standard IPC-Class-2
Availability Worldwide
Components / Pads / Vias / Nets 36 / 28 / 17 / 2

 

 

Material Advantages: RO4533™

The RO4533™ laminate from Rogers Corporation is a cost-performance material specifically engineered and manufactured to meet the demanding requirements of the antenna market. As part of the RO4500™ Series, this ceramic-filled, glass-reinforced hydrocarbon-based material set extends the capabilities of the successful RO4000® product series into antenna applications.

 

DK value 3.3 RO4533 PCB built on 20mil high-frequency laminate, get the quote for your antenna design 1

 

Key material highlights:

 

Fully compatible with conventional FR-4 and high-temperature lead-free solder processing – no special treatment needed for plated through-hole preparation, unlike traditional PTFE-based laminates

 

Affordable alternative to more conventional PTFE antenna technologies, allowing designers to optimize price and performance

 

Halogen-free available to meet the most stringent "green" standards

 

Excellent PIM performance – typical values better than -157 dBc using two 43 dBm swept tones at 1900 MHz

 

 

The resin system is designed to provide ideal antenna performance. The CTE in both X and Y directions closely matches that of copper, reducing stresses in the PCB antenna. With a Tg exceeding 280°C, the low Z-axis CTE ensures excellent plated through-hole reliability. These properties, combined with dimensional stability of less than 0.05% (0.2 mm/m), make RO4533 an excellent candidate for printed circuit antenna applications. The material also provides increased thermal conductivity (0.6 W/m·K) over equivalent PTFE/woven glass materials, enabling antenna designs with increased power handling capability.

 

 

RO4533™ Material Properties

Property Test Condition Value Benefit
Dielectric Constant (εr) 10 GHz / 23°C 3.3 ±0.08 Controlled, stable Dk for antenna design
Dielectric Constant (εr) 2.5 GHz / 23°C 3.3 ±0.08 Consistent performance across bands
Dissipation Factor (tan δ) 2.5 GHz / 23°C 0.002 Ultra-low loss for high gain
Dissipation Factor (tan δ) 10 GHz / 23°C 0.0025 Maintains low loss at higher frequencies
PIM (Typical) Reflected 43 dBm swept tones ≤-157 dBc Excellent for base station antennas
Dielectric Strength 0.51 mm thickness >500 V/mil Robust voltage withstand
Dimensional Stability After etch <0.2 mm/m (<0.2 mils/inch) Higher yield on large panels
CTE (X-axis) -55°C to +288°C 13 ppm/°C Matched to copper, reduced stress
CTE (Y-axis) -55°C to +288°C 11 ppm/°C Matched to copper, reduced stress
CTE (Z-axis) -55°C to +288°C 37 ppm/°C Reliable PTH reliability
Thermal Conductivity 80°C 0.6 W/(m·K) Improved power handling
Moisture Absorption D48/50 0.02% Excellent for outdoor antennas
Tg (TMA) >280°C Withstands lead-free processing
Density 1.8 g/cm³ Lightweight
Copper Peel Strength 1 oz EDC, post solder float 1.2 N/mm (6.9 lbs/in) Reliable copper adhesion
Flammability UL 94 Non-FR Application-specific
Lead-Free Process Compatible Yes Ready for modern assembly

 

 

PCB Stackup & Construction

The board features a robust 2-layer stackup:

 

Top Copper (Layer 1): 1 oz (35μm) – Electrodeposited copper

 

Dielectric Core: Rogers RO4533™ – 20mil (0.508mm)

 

Bottom Copper (Layer 2): 1 oz (35μm) – Electrodeposited copper

 

Total Finished Thickness: 0.6mm

 

 

Minimum trace and space are 4/5 mils, with a minimum finished hole size of 0.25mm. Via plating thickness is 20μm, and no blind vias are used. The design supports 36 components, 28 total pads (18 thru-hole, 10 top SMT), 17 vias, and 2 nets.

 

The green top solder mask provides circuit protection and insulation, while the white silkscreen enables clear component identification. The bottom side remains unmasked, which may be beneficial for specific antenna grounding or thermal requirements.

 

 

Typical Applications

Thanks to its low loss, controlled Dk, and excellent PIM response, this PCB is ideally suited for:

 

Cellular infrastructure base station antennas

WiMAX antenna networks

Mobile infrastructure microstrip antenna applications

Passive intermodulation-sensitive designs

 

 

All PCBs are 100% electrically tested and shipped with a Certificate of Conformance per IPC-6012. For Gerber review, stackup confirmation, or volume pricing, please contact our technical sales team.

 

Карта сайта |  Политика конфиденциальности | Китай хорошо. Качество Bicheng Недавно поставленный ПХБ Доставщик. 2016-2026 Shenzhen Bicheng Electronics Technology Co., Ltd Все. Все права защищены.