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TLY-3 double-side laminate with Gold over silver finish using in Automotive radar

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Bicheng Недавно поставленный ПХБ

TLY-3 double-side laminate with Gold over silver finish using in Automotive radar

МОК:	1 шт
цена:	0.99-99USD/PCS
стандартная упаковка:	Упаковка
Срок доставки:	2-10 рабочих дней
способ оплаты:	T/T, PayPal
Пропускная способность:	50000pcs

Подробная информация

Описание продукта

Подробная информация

Место происхождения

КИТАЙ

Фирменное наименование

Taconic

Сертификация

ISO9001

Номер модели

TLY-3

Количество мин заказа:

Цена:

0.99-99USD/PCS

Упаковывая детали:

Упаковка

Время доставки:

2-10 рабочих дней

Условия оплаты:

T/T, PayPal

Поставка способности:

50000pcs

Описание продукта

TLY-3 2-Layer PCB: 20mil with Silver Gold Finish

The TLY-3 2-layer PCB is a high-performance circuit board designed for high-frequency RF and microwave applications. Featuring TLY-3 laminates, this PCB provides dimensional stability, low dielectric loss, and high peel strength, making it ideal for automotive radar, satellite communications, and phased array antennas. The Silver Gold finish (gold over silver) ensures superior solderability and signal integrity, providing reliability for millimeter-wave frequency designs.

Key Construction Details

Parameter	Specification
Base Material	TLY-3
Layer Count	2-layer (double-sided)
Board Dimensions	125mm x 47mm (± 0.15mm)
Minimum Trace/Space	4/6 mils
Minimum Hole Size	0.3mm
Blind Vias	None
Finished Thickness	0.6mm
Copper Weight	1oz (35μm) on both layers
Via Plating Thickness	20μm
Surface Finish	Silver plate / Gold plate (Gold over Silver)
Top Silkscreen	None
Bottom Silkscreen	None
Top Solder Mask	None
Bottom Solder Mask	None
Electrical Testing	100% tested prior to shipment

Features of TLY-3 Material

Dielectric Constant (Dk): 2.33 ± 0.02 at 10GHz, ensuring stable signal propagation.
Dissipation Factor (Df): 0.0012 at 10GHz for minimal signal loss.
Thermal Conductivity: 0.22 W/mK for efficient heat dissipation.
CTE (Coefficient of Thermal Expansion): X-axis: 26 ppm/°C, Y-axis: 15 ppm/°C, Z-axis: 217 ppm/°C
Peel Strength: 17 lbs/in for 1oz copper cladding.
Moisture Absorption: 0.02%, ensuring reliability in humid environments.
Flammability Rating: UL 94 V-0 for safety in high-risk applications.
Outgassing: Low outgassing characteristics (TML: 0.01%, CVCM: 0.01%) for aerospace and space applications.

Data Sheet of Taconic TLY Material

TLY TYPICAL VALUES
Property	Test Method	Unit	Value	Unit	Value
DK at 10 GHz	IPC-650 2.5.5.5		2.2		2.2
Df at 10 GHz	IPC-650 2.5.5.5		0.0009		0.0009
Moisture Absorption	IPC-650 2.6.2.1	%	0.02	%	0.02
Dielectric Breakdown	IPC-650 2.5.6	kV	>45	kV	>45
Dielectric Strength	ASTM D 149	V/mil	2,693	V/mil	106,023
Volume Resistivity	IPC-650 2.5.17.1(after elevated temp.)	Mohms/cm	1010	Mohms/cm	1010
Volume Resistivity	IPC-650 2.5.17.1(after humidity)	Mohms/cm	1010	Mohms/cm	109
Surface Resistivity	IPC-650 2.5.17.1(after elevated temp.)	Mohms	108	Mohms	108
Surface Resistivity	IPC-650 2.5.17.1(after humidity)	Mohms	108	Mohms	108
Flex Strength(MD)	IPC-650 2.4.4	psi	14,057	N/mm2	96.91
Flex Strength(CD)	IPC-650 2.4.4	psi	12,955	N/mm2	89.32
Peel Stength(½ oz.ed copper)	IPC-650 2.4.8	Ibs./inch	11	N/mm	1.96
Peel Stength(1 oz.CL1 copper)	IPC-650 2.4.8	Ibs./inch	16	N/mm	2.86
Peel Stength(1 oz..CV1 copper)	IPC-650 2.4.8	Ibs./inch	17	N/mm	3.04
Peel Stength	IPC-650 2.4.8(after elevated temp.)	Ibs./inch	13	N/mm	2.32
Young's Modulus(MD)	ASTM D 3039/IPC-650 2.4.19	psi	1.4 x 106	N/mm2	9.65 x 103
Poisson's Ratio(MD)	ASTM D 3039/IPC-650 2.4.19		0.21		0.21
Thermal Conductivity	ASTM F 433	W/M*K	0.22	W/M*K	0.22
Dimensional Stability(MD,10mil)	IPC-650 2.4.39(avg.after bake&thermal stress)	mils/inch	-0.038		-0.038
Dimensional Stability(CD,10mil)	IPC-650 2.4.39(avg.after bake&thermal stress)	mils/inch	-0.031		-0.031
Density(Specific Gravity)	ASTM D 792	g/cm3	2.19	g/cm3	2.19
CTE(X axis)(25-260℃)	ASTM D 3386(TMA)	ppm/℃	26	ppm/℃	26
CTE(Y axis)(25-260℃)	ASTM D 3386(TMA)	ppm/℃	15	ppm/℃	15
CTE(Z axis)(25-260℃)	ASTM D 3386(TMA)	ppm/℃	217	ppm/℃	217
NASA Outgassing(% TML)			0.01		0.01
NASA Outgassing(% CVCM)			0.01		0.01
NASA Outgassing(% WVR)			0.00		0.00
UL-94 Flammability Rating	UL-94		V-0		V-0

Applications of TLY-3 PCB

Automotive Radar Systems

Satellite and Cellular Communications

Power Amplifiers

Low Noise Block Converters (LNBs), Low Noise Amplifiers (LNAs), and Low Noise Combiners (LNCs)

Aerospace Applications

Ka, E, and W Band Applications

Filters and Couplers

Phased Array Antennas

Why Choose TLY-3 PCB?

Superior High-Frequency Performance: The low Dk (2.33 ± 0.02) and low Df (0.0012) ensure minimal signal loss and stable performance at millimeter-wave frequencies.

Reliable in Harsh Environments: High peel strength, low moisture absorption, and low outgassing make it ideal for aerospace, automotive, and outdoor systems.

Ease of Manufacturing: The woven fiberglass matrix provides dimensional stability, enabling high manufacturing yields.

Environmentally Friendly: The PCB meets UL 94 V-0 flammability standards and exhibits low outgassing, ensuring sustainability and safety.

The TLY-3 2-layer PCB is the perfect solution for RF and microwave engineers seeking low-loss, high-reliability materials for advanced communication and radar systems.

Тэги:

высокоскоростной pcb,

высокочастотный расчет цепи,

bluetooth circuit board

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TLY-3 double-side laminate with Gold over silver finish using in Automotive radar

МОК:	1 шт
цена:	0.99-99USD/PCS
стандартная упаковка:	Упаковка
Срок доставки:	2-10 рабочих дней
способ оплаты:	T/T, PayPal
Пропускная способность:	50000pcs

Подробная информация

Описание продукта

Подробная информация

Место происхождения

КИТАЙ

Фирменное наименование

Taconic

Сертификация

ISO9001

Номер модели

TLY-3

Количество мин заказа:

1 шт

Цена:

0.99-99USD/PCS

Упаковывая детали:

Упаковка

Время доставки:

2-10 рабочих дней

Условия оплаты:

T/T, PayPal

Поставка способности:

50000pcs

Описание продукта

TLY-3 2-Layer PCB: 20mil with Silver Gold Finish

Key Construction Details

Parameter	Specification
Base Material	TLY-3
Layer Count	2-layer (double-sided)
Board Dimensions	125mm x 47mm (± 0.15mm)
Minimum Trace/Space	4/6 mils
Minimum Hole Size	0.3mm
Blind Vias	None
Finished Thickness	0.6mm
Copper Weight	1oz (35μm) on both layers
Via Plating Thickness	20μm
Surface Finish	Silver plate / Gold plate (Gold over Silver)
Top Silkscreen	None
Bottom Silkscreen	None
Top Solder Mask	None
Bottom Solder Mask	None
Electrical Testing	100% tested prior to shipment

Features of TLY-3 Material

Dielectric Constant (Dk): 2.33 ± 0.02 at 10GHz, ensuring stable signal propagation.
Dissipation Factor (Df): 0.0012 at 10GHz for minimal signal loss.
Thermal Conductivity: 0.22 W/mK for efficient heat dissipation.
CTE (Coefficient of Thermal Expansion): X-axis: 26 ppm/°C, Y-axis: 15 ppm/°C, Z-axis: 217 ppm/°C
Peel Strength: 17 lbs/in for 1oz copper cladding.
Moisture Absorption: 0.02%, ensuring reliability in humid environments.
Flammability Rating: UL 94 V-0 for safety in high-risk applications.
Outgassing: Low outgassing characteristics (TML: 0.01%, CVCM: 0.01%) for aerospace and space applications.

Data Sheet of Taconic TLY Material

TLY TYPICAL VALUES
Property	Test Method	Unit	Value	Unit	Value
DK at 10 GHz	IPC-650 2.5.5.5		2.2		2.2
Df at 10 GHz	IPC-650 2.5.5.5		0.0009		0.0009
Moisture Absorption	IPC-650 2.6.2.1	%	0.02	%	0.02
Dielectric Breakdown	IPC-650 2.5.6	kV	>45	kV	>45
Dielectric Strength	ASTM D 149	V/mil	2,693	V/mil	106,023
Volume Resistivity	IPC-650 2.5.17.1(after elevated temp.)	Mohms/cm	1010	Mohms/cm	1010
Volume Resistivity	IPC-650 2.5.17.1(after humidity)	Mohms/cm	1010	Mohms/cm	109
Surface Resistivity	IPC-650 2.5.17.1(after elevated temp.)	Mohms	108	Mohms	108
Surface Resistivity	IPC-650 2.5.17.1(after humidity)	Mohms	108	Mohms	108
Flex Strength(MD)	IPC-650 2.4.4	psi	14,057	N/mm2	96.91
Flex Strength(CD)	IPC-650 2.4.4	psi	12,955	N/mm2	89.32
Peel Stength(½ oz.ed copper)	IPC-650 2.4.8	Ibs./inch	11	N/mm	1.96
Peel Stength(1 oz.CL1 copper)	IPC-650 2.4.8	Ibs./inch	16	N/mm	2.86
Peel Stength(1 oz..CV1 copper)	IPC-650 2.4.8	Ibs./inch	17	N/mm	3.04
Peel Stength	IPC-650 2.4.8(after elevated temp.)	Ibs./inch	13	N/mm	2.32
Young's Modulus(MD)	ASTM D 3039/IPC-650 2.4.19	psi	1.4 x 106	N/mm2	9.65 x 103
Poisson's Ratio(MD)	ASTM D 3039/IPC-650 2.4.19		0.21		0.21
Thermal Conductivity	ASTM F 433	W/M*K	0.22	W/M*K	0.22
Dimensional Stability(MD,10mil)	IPC-650 2.4.39(avg.after bake&thermal stress)	mils/inch	-0.038		-0.038
Dimensional Stability(CD,10mil)	IPC-650 2.4.39(avg.after bake&thermal stress)	mils/inch	-0.031		-0.031
Density(Specific Gravity)	ASTM D 792	g/cm3	2.19	g/cm3	2.19
CTE(X axis)(25-260℃)	ASTM D 3386(TMA)	ppm/℃	26	ppm/℃	26
CTE(Y axis)(25-260℃)	ASTM D 3386(TMA)	ppm/℃	15	ppm/℃	15
CTE(Z axis)(25-260℃)	ASTM D 3386(TMA)	ppm/℃	217	ppm/℃	217
NASA Outgassing(% TML)			0.01		0.01
NASA Outgassing(% CVCM)			0.01		0.01
NASA Outgassing(% WVR)			0.00		0.00
UL-94 Flammability Rating	UL-94		V-0		V-0

Applications of TLY-3 PCB

Automotive Radar Systems

Satellite and Cellular Communications

Power Amplifiers

Low Noise Block Converters (LNBs), Low Noise Amplifiers (LNAs), and Low Noise Combiners (LNCs)

Aerospace Applications

Ka, E, and W Band Applications

Filters and Couplers

Phased Array Antennas

Why Choose TLY-3 PCB?

Superior High-Frequency Performance: The low Dk (2.33 ± 0.02) and low Df (0.0012) ensure minimal signal loss and stable performance at millimeter-wave frequencies.

Reliable in Harsh Environments: High peel strength, low moisture absorption, and low outgassing make it ideal for aerospace, automotive, and outdoor systems.

Ease of Manufacturing: The woven fiberglass matrix provides dimensional stability, enabling high manufacturing yields.

Environmentally Friendly: The PCB meets UL 94 V-0 flammability standards and exhibits low outgassing, ensuring sustainability and safety.

The TLY-3 2-layer PCB is the perfect solution for RF and microwave engineers seeking low-loss, high-reliability materials for advanced communication and radar systems.

Тэги: