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Rogers TMM10i double sided material make for multilayer PCB with Immersion Tin using in RF and microwave applications

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Bicheng Недавно поставленный ПХБ

Rogers TMM10i double sided material make for multilayer PCB with Immersion Tin using in RF and microwave applications

МОК:	1 шт
цена:	0.99-99USD/PCS
стандартная упаковка:	Упаковка
Срок доставки:	2-10 рабочих дней
способ оплаты:	T/T, PayPal
Пропускная способность:	50000pcs

Подробная информация

Описание продукта

Подробная информация

Место происхождения

КИТАЙ

Фирменное наименование

Rogers

Сертификация

ISO9001

Номер модели

TMM10i

Количество мин заказа:

Цена:

0.99-99USD/PCS

Упаковывая детали:

Упаковка

Время доставки:

2-10 рабочих дней

Условия оплаты:

T/T, PayPal

Поставка способности:

50000pcs

Описание продукта

TMM10i 2-Layer PCB: 30mil with Immersion Tin Finish

The TMM10i 2-layer PCB is a high-performance circuit board designed specifically for RF and microwave applications. Built with Rogers TMM10i laminates, this PCB offers exceptional dielectric stability, high mechanical reliability, and ease of processing. The 30mil TMM10i core ensures a low-loss, high-frequency response, making it ideal for advanced communication systems like satellite and GPS antennas. The Immersion Tin surface finish further enhances solderability and protects copper traces during assembly.

Rogers TMM10i double sided material make for multilayer PCB with Immersion Tin using in RF and microwave applications 0

Key Construction Details

Parameter	Specification
Base Material	Rogers TMM10i
Layer Count	2 layers (Double-sided)
Board Dimensions	70mm x 75mm (± 0.15mm)
Minimum Trace/Space	6/4 mils
Minimum Hole Size	0.3mm
Blind Vias	None
Finished Thickness	0.8mm
Copper Weight	1oz (35μm) on both layers
Via Plating Thickness	20μm
Surface Finish	Immersion Tin
Top Silkscreen	None
Bottom Silkscreen	None
Top Solder Mask	None
Bottom Solder Mask	None
Electrical Testing	100% tested prior to shipment

Features of TMM10i Material

Dielectric Constant (Dk): 9.80 ± 0.245 for stable signal propagation.
Dissipation Factor (Df): 0.0020 at 10GHz for low insertion loss.
Thermal Coefficient of Dk: -43 ppm/°K, maintaining stable performance across temperature changes.
CTE (Coefficient of Thermal Expansion): X-axis: 19 ppm/K, Y-axis: 19 ppm/K, Z-axis: 20 ppm/K
Decomposition Temperature (Td): 425°C for high thermal reliability.
Thermal Conductivity: 0.76 W/mK for efficient heat dissipation.
Peel Strength: Excellent adhesion for reliable copper cladding.

Data Sheet of TMM10

Property		TMM10i	Direction	Units	Condition	Test Method
Dielectric Constant,εProcess		9.80±0.245	Z		10 GHz	IPC-TM-650 2.5.5.5
Dielectric Constant,εDesign		9.9	-	-	8GHz to 40 GHz	Differential Phase Length Method
Dissipation Factor (process)		0.002	Z	-	10 GHz	IPC-TM-650 2.5.5.5
Thermal Coefficient of dielectric constant		-43	-	ppm/°K	-55℃-125℃	IPC-TM-650 2.5.5.5
Insulation Resistance		>2000	-	Gohm	C/96/60/95	ASTM D257
Volume Resistivity		2 x 108	-	Mohm.cm	-	ASTM D257
Surface Resistivity		4 x 107	-	Mohm	-	ASTM D257
Electrical Strength(dielectric strength)		267	Z	V/mil	-	IPC-TM-650 method 2.5.6.2
Thermal Properties
Decompositioin Temperature(Td)		425	425	℃TGA	-	ASTM D3850
Coefficient of Thermal Expansion - x		19	X	ppm/K	0 to 140 ℃	ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Y		19	Y	ppm/K	0 to 140 ℃	ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Z		20	Z	ppm/K	0 to 140 ℃	ASTM E 831 IPC-TM-650, 2.4.41
Thermal Conductivity		0.76	Z	W/m/K	80 ℃	ASTM C518
Mechanical Properties
Copper Peel Strength after Thermal Stress		5.0 (0.9)	X,Y	lb/inch (N/mm)	after solder float 1 oz. EDC	IPC-TM-650 Method 2.4.8
Flexural Strength (MD/CMD)		-	X,Y	kpsi	A	ASTM D790
Flexural Modulus (MD/CMD)		1.8	X,Y	Mpsi	A	ASTM D790
Physical Properties
Moisture Absorption (2X2)	1.27mm (0.050")	0.16	-	%	D/24/23	ASTM D570
Moisture Absorption (2X2)	3.18mm (0.125")	0.13	-	%	D/24/23	ASTM D570
Specific Gravity		2.77	-	-	A	ASTM D792
Specific Heat Capacity		0.72	-	J/g/K	A	Calculated
Lead-Free Process Compatible		YES	-	-	-	-

Applications of TMM10i PCB

RF and Microwave Circuitry

Power Amplifiers and Combiners

Filters and Couplers

Satellite Communication Systems

Global Positioning System (GPS) Antennas

Patch Antennas

Dielectric Polarizers and Lenses

Chip Testers

Why Choose TMM10i PCB?

Exceptional Dielectric Stability: With a Dk of 9.80 ± 0.245, TMM10i ensures precise signal integrity at high frequencies.

Low Signal Loss: The Df of 0.0020 makes it suitable for high-power RF applications.

Thermal and Mechanical Reliability: The high decomposition temperature and CTE matched to copper ensure performance in demanding environments.

Ease of Manufacturing: The material supports standard PCB processing, reducing fabrication complexity and costs.

Environmentally Friendly: Lead-free and RoHS-compliant, ensuring sustainability and compliance with modern standards.

The TMM10i 2-layer PCB is the perfect choice for RF engineers and designers seeking a high-performance, high-reliability solution for microwave and communication systems.

Тэги:

высокоскоростной pcb,

высокочастотный расчет цепи,

bluetooth circuit board

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Rogers TMM10i double sided material make for multilayer PCB with Immersion Tin using in RF and microwave applications

МОК:	1 шт
цена:	0.99-99USD/PCS
стандартная упаковка:	Упаковка
Срок доставки:	2-10 рабочих дней
способ оплаты:	T/T, PayPal
Пропускная способность:	50000pcs

Подробная информация

Описание продукта

Подробная информация

Место происхождения

КИТАЙ

Фирменное наименование

Rogers

Сертификация

ISO9001

Номер модели

TMM10i

Количество мин заказа:

1 шт

Цена:

0.99-99USD/PCS

Упаковывая детали:

Упаковка

Время доставки:

2-10 рабочих дней

Условия оплаты:

T/T, PayPal

Поставка способности:

50000pcs

Описание продукта

TMM10i 2-Layer PCB: 30mil with Immersion Tin Finish

Rogers TMM10i double sided material make for multilayer PCB with Immersion Tin using in RF and microwave applications 0

Key Construction Details

Parameter	Specification
Base Material	Rogers TMM10i
Layer Count	2 layers (Double-sided)
Board Dimensions	70mm x 75mm (± 0.15mm)
Minimum Trace/Space	6/4 mils
Minimum Hole Size	0.3mm
Blind Vias	None
Finished Thickness	0.8mm
Copper Weight	1oz (35μm) on both layers
Via Plating Thickness	20μm
Surface Finish	Immersion Tin
Top Silkscreen	None
Bottom Silkscreen	None
Top Solder Mask	None
Bottom Solder Mask	None
Electrical Testing	100% tested prior to shipment

Features of TMM10i Material

Dielectric Constant (Dk): 9.80 ± 0.245 for stable signal propagation.
Dissipation Factor (Df): 0.0020 at 10GHz for low insertion loss.
Thermal Coefficient of Dk: -43 ppm/°K, maintaining stable performance across temperature changes.
CTE (Coefficient of Thermal Expansion): X-axis: 19 ppm/K, Y-axis: 19 ppm/K, Z-axis: 20 ppm/K
Decomposition Temperature (Td): 425°C for high thermal reliability.
Thermal Conductivity: 0.76 W/mK for efficient heat dissipation.
Peel Strength: Excellent adhesion for reliable copper cladding.

Data Sheet of TMM10

Property		TMM10i	Direction	Units	Condition	Test Method
Dielectric Constant,εProcess		9.80±0.245	Z		10 GHz	IPC-TM-650 2.5.5.5
Dielectric Constant,εDesign		9.9	-	-	8GHz to 40 GHz	Differential Phase Length Method
Dissipation Factor (process)		0.002	Z	-	10 GHz	IPC-TM-650 2.5.5.5
Thermal Coefficient of dielectric constant		-43	-	ppm/°K	-55℃-125℃	IPC-TM-650 2.5.5.5
Insulation Resistance		>2000	-	Gohm	C/96/60/95	ASTM D257
Volume Resistivity		2 x 108	-	Mohm.cm	-	ASTM D257
Surface Resistivity		4 x 107	-	Mohm	-	ASTM D257
Electrical Strength(dielectric strength)		267	Z	V/mil	-	IPC-TM-650 method 2.5.6.2
Thermal Properties
Decompositioin Temperature(Td)		425	425	℃TGA	-	ASTM D3850
Coefficient of Thermal Expansion - x		19	X	ppm/K	0 to 140 ℃	ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Y		19	Y	ppm/K	0 to 140 ℃	ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Z		20	Z	ppm/K	0 to 140 ℃	ASTM E 831 IPC-TM-650, 2.4.41
Thermal Conductivity		0.76	Z	W/m/K	80 ℃	ASTM C518
Mechanical Properties
Copper Peel Strength after Thermal Stress		5.0 (0.9)	X,Y	lb/inch (N/mm)	after solder float 1 oz. EDC	IPC-TM-650 Method 2.4.8
Flexural Strength (MD/CMD)		-	X,Y	kpsi	A	ASTM D790
Flexural Modulus (MD/CMD)		1.8	X,Y	Mpsi	A	ASTM D790
Physical Properties
Moisture Absorption (2X2)	1.27mm (0.050")	0.16	-	%	D/24/23	ASTM D570
Moisture Absorption (2X2)	3.18mm (0.125")	0.13	-	%	D/24/23	ASTM D570
Specific Gravity		2.77	-	-	A	ASTM D792
Specific Heat Capacity		0.72	-	J/g/K	A	Calculated
Lead-Free Process Compatible		YES	-	-	-	-

Applications of TMM10i PCB

RF and Microwave Circuitry

Power Amplifiers and Combiners

Filters and Couplers

Satellite Communication Systems

Global Positioning System (GPS) Antennas

Patch Antennas

Dielectric Polarizers and Lenses

Chip Testers

Why Choose TMM10i PCB?

Exceptional Dielectric Stability: With a Dk of 9.80 ± 0.245, TMM10i ensures precise signal integrity at high frequencies.

Low Signal Loss: The Df of 0.0020 makes it suitable for high-power RF applications.

Thermal and Mechanical Reliability: The high decomposition temperature and CTE matched to copper ensure performance in demanding environments.

Ease of Manufacturing: The material supports standard PCB processing, reducing fabrication complexity and costs.

Environmentally Friendly: Lead-free and RoHS-compliant, ensuring sustainability and compliance with modern standards.

The TMM10i 2-layer PCB is the perfect choice for RF engineers and designers seeking a high-performance, high-reliability solution for microwave and communication systems.

Тэги: