TMM10i High-DK Thermoset Microwave Laminate Q&A: Dk 9.8, Low Loss, and Copper-Matched CTE for RF & Satellite PCBs

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What is TMM10i?

It is a ceramic-filled thermoset microwave laminate manufactured by Rogers Corporation. It is part of the TMM® series. The dielectric constant (Dk) is 9.80 ±0.245 at 10 GHz. The dissipation factor (Df) is 0.0020 at 10 GHz. The material has an isotropic dielectric constant. The CTE is 19 ppm/°C in all directions (X, Y, and Z). This matches the CTE of copper. The decomposition temperature (Td) is 425°C. The thermal conductivity is 0.76 W/(m·K). The material is a thermoset resin. It does not soften when heated. Wire bonding can be performed without concerns of pad lifting or substrate deformation. No sodium napthanate treatment is required before electroless plating.

 

 

What PCB can be built with it?

A complete 2-layer RF PCB solution can be provided. The board is based on TMM10i material. The finished thickness is 0.8 mm. The copper weight is 1 oz per layer. ENIG (Electroless Nickel/Immersion Gold) is applied as the surface finish. Black solder mask is applied on both sides. White silkscreen is printed on both sides. Edge plating is applied. The minimum trace and space are 6 and 9 mils. The minimum hole size is 0.4 mm. Via plating thickness is 20 µm. The quality standard is IPC Class 2. This board is ideal for RF/microwave circuitry, power amplifiers, filters, satellite communication systems, GPS antennas, and chip testers.

 

 

1. Material Overview

TMM10i is a thermoset microwave material. It is manufactured by Rogers Corporation. It is part of the TMM® series. It is a ceramic-filled hydrocarbon thermoset polymer composite. It is designed for high plated-through-hole reliability. It is suitable for stripline and microstrip applications.

 

 

The TMM series combines many of the desirable features of ceramic substrates with the ease of soft substrate processing techniques. It does not require specialized production techniques. It does not require sodium napthanate treatment before electroless plating. This reduces fabrication complexity and cost.

 

 

Key Features of TMM10i:

 

Isotropic Dielectric Constant — The Dk is the same in all directions. This simplifies design and ensures consistent performance.

 

High Dielectric Constant — The Dk is 9.80 ±0.245. This allows smaller circuit sizes to be achieved.

 

Low Dissipation Factor — The Df is 0.0020 at 10 GHz. Signal loss is minimized.

 

Copper-Matched CTE — The CTE is 19 ppm/°C in all directions. This matches the CTE of copper. Excellent dimensional stability is achieved. High plated-through-hole reliability is ensured.

 

Thermoset Resin — The material does not soften when heated. Wire bonding can be performed without concerns of pad lifting or substrate deformation.

 

Thermal Conductivity — The thermal conductivity is 0.76 W/(m·K). This is approximately twice that of traditional PTFE/ceramic laminates. Heat removal is facilitated.

 

Chemical Resistance — The material is resistant to etchants and solvents. All common PWB processes can be used.

 

Creep and Cold Flow Resistance — The mechanical properties resist creep and cold flow. Dimensional stability is maintained over time.

 

 

 

2. TMM10i Technical Data Sheet

 

Property	Typical Value	Direction	Units	Condition	Test Method
Dielectric Constant (process)	9.80 ±0.245	Z	—	10 GHz	IPC-TM-650 2.5.5.5
Dielectric Constant (design)	9.9	—	—	8–40 GHz	Differential Phase Length
Dissipation Factor	0.002	Z	—	10 GHz	IPC-TM-650 2.5.5.5
TCDk	-43	—	ppm/°K	-55 to +125°C	IPC-TM-650 2.5.5.5
Insulation Resistance	>2000	—	GΩ	C/96/60/95	ASTM D257
Volume Resistivity	2×10⁸	—	MΩ·cm	—	ASTM D257
Surface Resistivity	4×10⁷	—	MΩ	—	ASTM D257
Electrical Strength	267	Z	V/mil	—	IPC-TM-650 2.5.6.2
Decomposition Temperature (Td)	425	—	°C	—	ASTM D3850
CTE X-axis	19	X	ppm/K	0 to 140°C	ASTM E 831 / IPC-TM-650 2.4.41
CTE Y-axis	19	Y	ppm/K	0 to 140°C	ASTM E 831 / IPC-TM-650 2.4.41
CTE Z-axis	20	Z	ppm/K	0 to 140°C	ASTM E 831 / IPC-TM-650 2.4.41
Thermal Conductivity	0.76	Z	W/(m·K)	80°C	ASTM C518
Copper Peel Strength	5.0 (0.9)	X,Y	lb/in (N/mm)	after solder float	IPC-TM-650 2.4.8
Flexural Modulus	1.8	X,Y	Mpsi	A	ASTM D790
Moisture Absorption (1.27 mm)	0.16	—	%	D/24/23	ASTM D570
Moisture Absorption (3.18 mm)	0.13	—	%	D/24/23	ASTM D570
Specific Gravity	2.77	—	—	A	ASTM D792
Specific Heat Capacity	0.72	—	J/g/K	A	Calculated
Lead-Free Process Compatible	YES	—	—	—	—

 

 

 

3. Key Advantages of TMM10i

Feature	Benefit
Dk is 9.80 ±0.245	High Dk allows smaller circuit sizes; isotropic Dk simplifies design
Df is 0.0020 at 10 GHz	Low loss minimizes signal attenuation in microwave circuits
CTE is 19 ppm/°C (X/Y/Z)	CTE matches copper; excellent dimensional stability; high PTH reliability
TCDk is -43 ppm/°K	Stable Dk over temperature ensures consistent performance
Td is 425°C	Exceptional thermal decomposition resistance is provided
Thermal conductivity is 0.76 W/(m·K)	Heat dissipation is improved compared to standard PTFE
Thermoset resin is used	No softening when heated; reliable wire bonding; no pad lifting
No sodium napthanate treatment is required	Standard processing is used; fabrication is simplified
Resists creep and cold flow	Long-term dimensional stability is maintained
Chemical resistance is provided	Damage during fabrication is reduced

 

 

 

4. Application Fields

- RF and microwave circuitry

- Power amplifiers and combiners

- Filters and coupler

- Satellite communication systems

- Global Positioning Systems Antennas

- Patch Antennas

- Dielectric polarizers and lenses

- Chip testers

 

 

 

5. Custom 2-Layer RF PCB – Complete Specification

A complete 2-layer RF PCB solution can be provided based on TMM10i. The specifications are shown below.

 

 

Board Specifications

Specification	Detail
Board Type	2-Layer RF PCB
Base Material	Rogers TMM10i (0.762 mm / 30 mil core)
Finished Board Thickness	0.8 mm
Finished Copper Weight	1 oz (35 µm) per layer
Board Dimensions	104.8 × 99.01 mm (1 piece)
Dimension Tolerance	±0.15 mm
Minimum Trace / Space	6 / 9 mils
Minimum Hole Size	0.4 mm
Via Plating Thickness	20 µm
Surface Finish	ENIG (Electroless Nickel/Immersion Gold)
Top Solder Mask	Black
Bottom Solder Mask	Black
Top Silkscreen	White
Bottom Silkscreen	White
Edge Plating	Yes
IPC Classification	Class 2
Artwork Format	Gerber RS-274-X
Testing	100% Electrical Test (before shipment)
Availability	Worldwide

 

 

 

6. Key Benefits of This PCB Design

Feature	Benefit
2-layer RF design is used	Simple and cost-effective RF circuit implementation is achieved
TMM10i core (0.762 mm) is used	High Dk (9.8) allows smaller circuit sizes; low loss (0.0020) ensures signal integrity
6/9 mil trace and space are used	Fine-line, high-density RF circuits can be produced
Black solder mask is applied on both sides	Professional appearance; circuit protection on both sides
ENIG finish is applied	Excellent solderability; oxidation resistance; flat surface
Edge plating is applied	Shielding and grounding are improved
20 µm via plating is used	Reliable plated through-hole connections are ensured
IPC Class 2 quality is met	Commercial and industrial quality standards are satisfied
100% electrical test is performed	Functional integrity is guaranteed before shipment

 

 

 

7. Why Edge Plating Is Used

Edge plating is applied to this PCB. The advantages are listed below.

Advantage	Benefit
Shielding is improved	RF signals are contained; EMI is reduced
Grounding is enabled	Direct chassis grounding is possible
Mechanical strength is improved	Board edges are protected
Solderability is provided	Edge connections can be soldered

 

 

Comparison Table – TMM10i vs. TMM10 vs. TMM6

Parameter	TMM10i	TMM10	TMM6
Dk at 10 GHz	9.80 ±0.245	9.20 ±0.23	6.00 ±0.15
Df at 10 GHz	0.002	0.002	0.002
CTE X/Y (ppm/°C)	19/19	19/19	19/19
CTE Z (ppm/°C)	20	20	20
Td (°C)	425	425	425
Thermal Conductivity (W/m·K)	0.76	0.76	0.76
Isotropic Dk	Yes	Yes	Yes
Primary Use	High-DK RF, alumina replacement	High-DK RF	Medium-DK RF

 

 

 

Q1: What is the dielectric constant of TMM10i?

The process Dk is 9.80 ±0.245 at 10 GHz. The design Dk is 9.9 from 8 GHz to 40 GHz. The Dk is isotropic. This means it is the same in all directions (X, Y, and Z). This simplifies design and ensures consistent performance.

 

 

Q2: What is the dissipation factor of TMM10i?

The dissipation factor (Df) is 0.0020 at 10 GHz. This low loss minimizes signal attenuation in microwave circuits.

 

 

Q3: Why is the CTE of TMM10i important?

The CTE is 19 ppm/°C in all directions (X, Y, and Z). This matches the CTE of copper. Excellent dimensional stability is provided. High plated-through-hole reliability is ensured. This is important for boards that are subjected to temperature cycling.

 

 

Q4: Why is TMM10i a thermoset material and why does it matter?

TMM10i is based on a thermoset resin. It does not soften when heated. Wire bonding of component leads to circuit traces can be performed without concerns of pad lifting or substrate deformation. This is a significant advantage over PTFE-based materials.

 

 

 

Ready to Get Started?

TMM10i raw laminate can be provided. Fully fabricated 2-layer RF PCBs with ENIG finish and edge plating can be manufactured.

 

Contact us today for:

 

Material sampling and testing

 

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