logo
Russian
контактные данные

Контактное лицо : Sally Mao

Номер телефона : 86-755-27374847

Ватсап : +8618277967574

Free call
Главная страница ПродукцияГибридная доска PCB10-layer multilayer hybrid RO4350B+Tg170 TU-768 FR4 RF/microwave PCB with Resin-Filled and Plated-Flat Vias
10-layer multilayer hybrid RO4350B+Tg170 TU-768 FR4 RF/microwave PCB with Resin-Filled and Plated-Flat Vias
10-layer multilayer hybrid RO4350B+Tg170 TU-768 FR4 RF/microwave PCB with Resin-Filled and Plated-Flat Vias 10-layer multilayer hybrid RO4350B+Tg170 TU-768 FR4 RF/microwave PCB with Resin-Filled and Plated-Flat Vias 10-layer multilayer hybrid RO4350B+Tg170 TU-768 FR4 RF/microwave PCB with Resin-Filled and Plated-Flat Vias
Контакт

10-layer multilayer hybrid RO4350B+Tg170 TU-768 FR4 RF/microwave PCB with Resin-Filled and Plated-Flat Vias

Фирменное наименование: Rogers Номер модели: РО4350Б + Тг170 ТУ-768 ФР4

Характер продукции

This article presents a detailed design strategy for a 10-layer hybrid RF PCB that combines the exceptional high-frequency performance of Rogers RO4350B™ on both the top and bottom layers with the high thermal reliability and cost-effectiveness of Tg170 TU-768 FR4 in the inner layers. This hybrid construction is specifically engineered to meet the demands of complex RF/microwave modules requiring symmetric high-frequency performance, multiple SMT reflow cycles, and reliable

Вы могли бы быть в этих
Свяжись с нами

Впишите ваше сообщение

sales30@bichengpcb.com
+8618277967574
BTL_SallyMao
.cid.455f73688e64dff1
431959212
86-755-27374847